qixing: IBM and Lam Research Join Forces to Usher in a New Era of Breakthrough in Sub-1nm Process Technology

Amid the global semiconductor industry's accelerated shift towards more advanced processes, on March 10, 2026, tech giant IBM and semiconductor equipment leader Lam Research officially announced a five-year strategic partnership to jointly tackle sub-1nm logic process technology. This collaboration marks the semiconductor industry's entry into the deep waters of the "post-1nm era" of research and development, potentially reshaping the performance boundaries of future AI chips.
A Powerful Alliance: Mutual Empowerment of Technological R& and Equipment Innovation
This collaboration focuses on three core areas: novel semiconductor materials, advanced etching/deposition processes, and High NA EUV (High Numerical Aperture Extreme Ultraviolet) lithography technology. IBM, leveraging its technological accumulation in 2nm chip development (as of 2021), will provide support for logic process and chip architecture design; while Lam Research, relying on its leading advantages in etching and deposition equipment, will address the equipment compatibility challenges faced at the sub-1nm node. The two parties will form a joint team to build a complete nanosheet device process flow at IBM's Albany campus, achieving closed-loop verification from R& to mass production.
Breaking Physical Limits: Three Key Technological Breakthroughs
New Material Exploration: Overcoming the limitations of quantum tunneling effects in traditional silicon-based materials to develop more stable and efficient semiconductor substrate materials;
Process Optimization: Improving etching precision and thin film deposition uniformity to address the process challenges brought about by the surge in circuit density at the sub-1nm node;
High NA EUV Lithography Deployment: Collaborating with ASML to commercialize 8nm resolution lithography technology with single-exposure capability. This technology offers a 40% improvement in imaging contrast compared to traditional EUV, making it crucial for sub-1nm mass production.
Targeting the AI ​​Era: A Future Blueprint for High-Performance Chips
Both parties clearly stated that the core objective of this collaboration is to develop low-power, high-performance transistors for the AI ​​era. With the explosive growth in computing power demand, the sub-1nm process is expected to elevate chip performance to new heights while reducing energy consumption. Lam Research executives emphasized, "This is a deep, collaborative revolution in equipment and processes, not just a process iteration."
Industry analysts point out that the collaboration between IBM and Lam Research may accelerate the global semiconductor industry's technology race, and the breakthroughs and commercialization of sub-1nm technology over the next five years are highly anticipated.

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